Technology

Technology

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Your reliable PCB solutions provider

Due to the advent of the multi-layer printed circuit board industry, the number of these types of boards has increased significantly. They are commonly used in various electronic devices, such as Power Control systems, Servers, Electric Vehicles, Medical devices  and 5G Base stations. JOVEPCB Enterprise Ltd. can produce these boards in various numbers, from small batches to large mass production. The maximum number of layers that the company can produce is 34 L.

 

JOVEPCB Enterprise Ltd. is a leading provider of printed circuit board manufacturing. We offer a wide range of solutions to our customers, which are some of the most innovative and exciting companies in the world. In conventional PCBs, we deliver exceptional quality and competitive prices. Through our global presence and advanced manufacturing capability, we are able to provide our customers with the peace of mind that they need.

 

Unlike other types of printed circuit boards, which are typically single-layer constructions, conventional multi-layer PCBs can be any number of layers with advanced technical requirements. Through our extensive capabilities, we are able to provide our customers with a complete solution that supports their various requirements at different design & NPI stages. Our PCB experts allow us to remain in step with the industry's technological demands.


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What can we do?

For over two decades,JOVEPCB Enterprise Ltd. has been working on the production of power PCBs. It is capable of producing heavy copper boards with a thickness of up to 12oz. It is also proficient in various production processes such as metal half hole(castellation), buried blind hole, and resin plug hole.

 

JOVEPCB Enterprise Ltd. is a leading manufacturer of flat transformers, which are used for fast charging devices such as smartphones, tablets, and computers. Through its extensive production capacity and processing technology, it has been able to provide high-quality & reliability products and services to its customers.

Technical Characteristics

  • Max. Layer count is 34 layers
  • Max. Aspect Ratio: 20:1
  • Tight Impedance Control Tolerance is ±8%
  • Depth control routing and backdrill capability
  • Tight Width/Spacing Tolerance Control
  • Insert Loss control capability 
  • Embedded Capacitor/Resistance
  • Support high thermal reliability requirement 
  • Embedded Copper Coin/Copper Inlay thermal solution

 

  • Heavy copper capability: Up to 10 oz. outer layer & 12 oz. inner layer
  • Support high thermal reliability requirement
  • Wide material range: Low loss/Ultra low loss/Extreme low loss/High thermal conductivity/High frequency/High speed/Halogen free laminates for wireless applications
  • Hybrid lamination for combination of FR4 with Low loss material 
  • Wide range selections for SM or Solder Mask and surface finishes.

 


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Manufacturing Process

AOI Test

AOI Test

Outer Layer Horizontal Line

Outer Layer Horizontal Line

Flying Probe Test

Flying Probe Test

Laser Routing

Laser Routing

Drilling Machine

Drilling Machine

Drilling Process

Drilling Process

Auto Loading

Auto Loading

Fixture of E-test

Fixture of E-test

LDI

LDI

Drilling

Drilling

AOI

AOI

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Technical Parameter

No. Capabilities Standard Production Advanced Production
1 Panel size Double sided HASL 544*800mm 620*800mm
ENIG/Immersion Tin 544*800mm 620*1200mm
≥4 layers HASL 544*650mm 620*710mm
ENIG/Immersion Tin 544*650mm 620*710mm
2 Stack up Blind/Buried board Lamination times MAX≤3times MAX≤4times
Copper thickness Inner layer 1/2Oz-6Oz 1/2Oz-12Oz
Outer layer 1/2Oz-6Oz 1/2Oz-12Oz
Min Dielectric ThK 0.1mm 0.043mm(≤3Oz)
Max Layer count 24L 34L
Final board ThK Tolerance ThK≤1.0mm ±0.1mm ±0.1mm
ThK>1.0mm ±10% ±8%
3 Line/Space Inner Layer 1/2OZ 4/4mil 3/3mil
1OZ 5/5mil 4/4mil
2OZ 7/7mil 6/6mil
3OZ 8/8mil 7/7mil
4OZ 10/10mil 8/8mil
5OZ 12/12mil 10/10mil
6OZ 14/14mil 12/12mil
Outer layer 1/3OZ 4/4mil 3/3mil
1/2OZ 4/4mil 4/4mil
1OZ 5/5mil 4.5/4.5mil
2OZ 8/8mil 7/7mil
3OZ 10/10mil 8/8mil
4OZ 12/12mil 10/10mil
5OZ 14/14mil 12/12mil
6OZ 16/16mil 14/14mil
Pad Tolerance ≤12mil ±1.2mil ±1.2mil
>12mil ±10% ±10%
4 Drill Mechanical Drill size 0.2-6.35mm 0.1-6.35mm
PTH Hole Tolerance ±0.075mm ±0.075mm
NPTH Hole Tolerance ±0.05mm ±0.05mm
Plated slot tolerance Long slot ±0.075mm ±0.075mm
Short Slot ±0.1mm ±0.1mm
Aspect Ratio  DHS=0.15mm 16:1 18:1
DHS=0.2mm 18:1 20:1
DHS ≥0.25mm 20:1 25:1
Back drill(Back drill/Depth-control drill) Hole size 0.4-1.0mm 0.4-6.35mm
Back drill relative to through hole D+0.2mm D+0.15mm
Back drill depth tolerance ±0.1mm ±0.08mm
Stub length 0.05-0.25mm 0.05-0.2mm
minimum distance between holes(different net) 0.4mm 0.3mm
minimum distance between holes(same net) 0.25mm 0.2mm
5 Min BGA 1.0mm BGA 2 trace Yes Yes
0.8mm BGA 1 trace Yes Yes
0.65mm BGA Yes Yes
0.5mm BGA Yes Yes
0.4mm BGA Yes Yes
0.35mm BGA No Yes
6 Laser Laser hole size 0.075-0.2mm 0.05-0.25mm
Min. distance from laser hole to laser hole 8mil 5.5mil
Laser hole size ≤0.8:1 ≤1:1
7 Soldermask Color Green,Yellow,Black,Blue,Red, White, Matt green Green,Yellow,Black,Blue,Red, White, Matt green
SM ThK Single print thickness 10-30um 10-30um
Double  print thickness 20-60um 20-60um
Trace knee ≥5um ≥5um
Min SM dam normal color 4.0mil,other color min 5mil normal color 3.0mil,other color min 4mil
8 Resin plugging hole size 0.15-0.6mm 0.1-0.8mm
PCB ThK 0.5-4.5mm 0.3-5.0mm
Resin plugging aspect ratio 20:1 30:1
9 Impedance Capability of Impedance Single line impedance<50Ω ±5Ω ±3.5Ω
Single line impedance≥50Ω ±10% ±7%
Differential line impedance ±10% ±7%
10 Testing Capability Max. Voltage 6000V(DC)
5000V(AC)
10000V(DC)
10000V(AC)
Inductance
VPP
Resistance 
Surface insulation resistance
Coil loop turns

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