Technology

Product and Technology

Technology

Flexible & Rigid Flexible PCBs

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Your reliable PCB solutions provider

The flexible and rigid-flex products provide a reliable solution for the integration of multiple rigid circuit board assemblies into a single board. These products can also reduce the weight and space requirements of the board.

 

A rigid-flex printed circuit board is a type of electronic device that combines the advantages of both flexible and rigid circuits. This type of board can be used to achieve various features, such as signal transmission and stability. JOVEPCB Enterprise Ltd. is a leading producer of this kind of board, and it offers a wide range of products and expertise.

 

JOVEPCB Enterprise Ltd.' s engineers are able to provide our customers with design guidance and help them find the optimal solutions for their specific requirements. Through our extensive experience in the field of rigid-flex and flex- dependent designs, we are able to help them improve their overall yield and reduce their cost of production. This close collaboration with our customers enables them to create innovative and sustainable solutions that help our customers to optimize the design of their products.

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What can we do？

In response to the increasing demand for flexible printed circuit boards, JOVEPCB Enterprise Ltd. is also able to support volume  production of the core HDI technology in combination with Flex printed circuit boards. 

Technical Characteristics

  • Combination of advanced HDI rigid and flex layers
  • 2-24L rigid board and 1-6L flexible board
  • Min LW/LS width is 40/40um  
  • The laminate combination of Flex board + high TG FR4 has passed UL certification
  • Cover unsymmetrical layup design

 

  • Cover unsymmetrical layup design Ultra-thin thickness for Coverlay and PI capability.
  • Dyamic bending capability Common surface finishings support
  • Rigid-flex board can be designed for high frequency/high speed and heavy copper (2oz inner layer, 3oz outer layer)

 

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Manufacturing Process

AOI Test

AOI Test

Outer Layer Horizontal Line

Outer Layer Horizontal Line

Flying Probe Test

Flying Probe Test

Laser Routing

Laser Routing

Drilling Machine

Drilling Machine

Drilling Process

Drilling Process

Auto Loading

Auto Loading

Fixture of E-test

Fixture of E-test

LDI

LDI

Drilling

Drilling

AOI

AOI

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Technical Parameter

 

Technical Parameters for Rigid-Flex PCB

 

No.   Capabilities Standard Production Advanced Production
1 Panel size Double side ENIG/Immersion Tin 250/500*900mm 250/500*1200mm
≥4 layers ENIG/Immersion Tin 250/500*710mm 250/500*1200mm
2 Stack up Blind/Buried board Pressing times MAX≤3times MAX≤3times
Copper thickness Inner layer 1/3OZ-2OZ（FCCL）
MAX 2OZ		 1/3OZ-2OZ（FCCL）
MAX 2OZ
Outer layer 1/3OZ-3OZmm 1/3OZ-3OZmm
Min Dielectric ThK 0.025mm（FCCL）
0.043mm（CCL）		 0.0125mm（FCCL）
0.043mm（CCL）
Max Layer count 18L 24L
Final board ThK Tolerance ThK≤1.0mm ±0.1mm ±0.1mm
ThK＞1.0mm ±10% ±10%
3 Line/Space Inner Layer 1/3OZ 2/2mil 1.5/1.5mil
1/2OZ 2.5/2.5mil 2/2mil
1OZ 3.0/3.0mil 3.0/3.0mil
2OZ 6/5.5mil 6/5.5mil
Outer layer 1/3OZ 3/3mil 3/3mil
1/2OZ 3.5/3.5mil 3.5/3.5mil
1OZ 5/5mil 5/5mil
2OZ 6/8mil 6/8mil
3OZ 8/11mil 8/11mil
Pad Tolerance ≤12mil ±1.2mil ±1.2mil
＞12mil ±10% ±10%
4 Drill Mechanical Drill size 0.15-6.35mm 0.1-6.35mm
PTH Hole Tolerance ±0.075mm ±0.075mm
NPTH Hole Tolerance ±0.05mm ±0.05mm
Plated slot tolderance Long slot ±0.075mm ±0.075mm
Short Slot ±0.1mm ±0.1mm
Aspect Ratio  DHS=0.15mm 7:1 7:1
DHS=0.2mm 10:1 10:1
DHS ≥0.25mm 15:1 15:1
Back drill(Back drill/Depth-control drill) Hole size 0.4-6.35mm 0.4-6.35mm
 Back drill relative to through hole ≥0.2mm ≥0.2mm
Back drill depth tolerance ±0.1mm ±0.1mm
Stub length 0.05-0.25 0.05-0.25
5 Min BGA 1.0mm BGA 2 trace Yes Yes
0.8mm BGA 1 trace Yes Yes
0.65mm BGA Yes Yes
0.5mm BGA Yes Yes
0.4mm BGA Yes(Sample) Yes(Sample)
6 Laser Laser hole size 0.07-0.2mm 0.05-0.2mm
Laser hole size ≤1:1 ≤1:1
7 Soldermask Color Green,Yellow,Black,Blue,Red, White, Matt green Green,Yellow,Black,Blue,Red, White, Matt green
SM ThK Single print thickness 10-30um 10-30um
Double  print thickness 20-60um 20-60um
The line corner ≥5um ≥5um
Min SM dam normal color 3.0mil，other color min 4mil normal color 3.0mil，other color min 4mil
8 Resin plugging hole size 0.15-0.6mm 0.1-0.6mm
PCB ThK 0.3-3.0mm 0.3-3.0mm
Resin plugging aspect ratio 12:1 12:1
9 Impedance Capability of Impedance Single line impedance<50Ω ±5Ω ±3.5Ω
Single line impedance≥50Ω ±10% ±7%
Differential line impedance ±10% ±7%

 

 

 

Technical Parameters for Flex PCB

 

No. Capabilities Standard Production Advanced Production
1 Panel size Double sided ENIG/Immersion Tin 250/500 *900mm 250/500 *1200mm
≥4 layers ENIG/Immersion Tin 250*800mm 250*800mm
2 Stack up Blind/Buried board Lamination times MAX≤2times MAX≤2times
Copper thickness Inner layer 1/3OZ-2oz
MAX 2OZ		 1/3OZ-2oz
MAX 2OZ
Outer layer 1/3OZ-2OZ 1/3OZ-3OZ
Min Dielectric ThK 0.0125mm 0.0125mm
Max Layer count 6L 8L
3 Line/Space Inner Layer 1/3OZ 2/2mil 1.5/1.5mil
1/2OZ 2.5/2.5mil 2/2mil
1OZ 3.0/3.0mil 3.0/3.0mil
2OZ 6/5.5mil 6/5.5mil
Outer Layer 1/3OZ 3/3mil 3/3mil
1/2OZ 3.5/3.5mil 3.5/3.5mil
1OZ 5/5mil 5/5mil
2OZ 6/8mil 6/8mil
3OZ 8/11mil 8/11mil
Pad Tolerance ≤12mil ±1.2mil ±1.2mil
＞12mil ±10% ±10%
4 Drill Mechanical Drill size 0.15-6.0mm 0.1-6.5mm
PTH Hole Tolerance ±0.075mm ±0.075mm
NPTH Hole Tolerance ±0.05mm ±0.05mm
Plated slot tolerance Long slot ±0.075mm ±0.075mm
Short Slot ±0.1mm ±0.1mm
5 Min BGA 1.0mm BGA 2 trace Yes Yes
0.8mm BGA 1 trace Yes Yes
0.65mm BGA Yes Yes
0.5mm BGA Yes Yes
0.4mm BGA Yes(Sample) Yes(Sample)
6 Laser Laser hole size 0.07-0.2mm 0.05-0.2mm
Laser hole size ≤1:1 ≤1:1
7 Soldermask Color Green,Yellow,Black,Blue,Red, White, Matt green Green,Yellow,Black,Blue,Red, White, Matt green
SM ThK Single print thickness 10-30um 10-30um
Min SM dam normal color 3.0mil，other color min 4mil normal color 3.0mil，other color min 4mil
8 Impedance Capability of Impedance Single line impedance<50Ω ±5Ω ±3.5Ω
Single line impedance≥50Ω ±10% ±7%
Differential line impedance ±10% ±7%
9 Lamination Coverlay alignment tolerance  ±0.15mm ±0.1mm
10 Adhere stiffener Stiffener alignment tolerance ±0.2mm ±0.15mm
11 Outline Laser/Punch ±0.05mm ±0.05mm
12 Construction Air Gap availability Yes Yes

 

 

 

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