Technology

Technology

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High-density PCBs are commonly used to connect various components in small packages. They are equipped with fine feature technology to improve their electrical performance. This type of board has a smaller footprint and is ideal for reducing the size of the components. In addition to reducing the size of the PCBs, these features also improve the performance of the electrical components.

 

HDI PCBs are used in the design of advanced technology products, such as high-speed chips and large pin-count and fine pitch components. Due to their various features, such as fine lines, laser microvias, multiple laminations and high speed laminates, these PCBs offer a wide range of functions per unit area. With the addition of stacked microvias, these PCBs provide the necessary signal integrity and routing solutions for today's demanding applications.

 

High-density PCBs (HDI PCBs) are designed with the latest technologies to improve their functionality and signal integrity. These features allow them to utilize the same or less area for multiple features. The rapid emergence and evolution of new technology in the printed circuit board (PCB) industry has allowed companies to create new products that are designed to meet the needs of today's society. Some of these include 5G communications, wearable medical devices, and autonomous vehicles.


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What can we do?

Since the introduction of high-density interconnect (HDI) printed circuit boards, their use has been increasing in the electronics industry. This is due to the introduction of new components such as BGA and CSP. JOVEPCB Enterprise Ltd. offers a wide range of technologies, including from 1+N+1 HDI , up to any layer HDI(ELIC).

 

Technical Characteristics

  • With up to 14 layer any layer capability
  • Min line width and spacing in volume production is around 40μm
  • Fine pitch BGA with 0.35mm
  • Capability of plated copper or filled with conductive paste for stacked microvias
  • Heavy Copper, embedded coin and provide a thermal management solution
  • Support planar surface for ball grid array ("BGA") (Via-in-Pad) Enhance impedance performance
  • Enhance impedance performance
  • Microvias solutions for Radio Frequency HDI boards
  • High speed material for hybrid HDI
  • Wide range laminate support (Low Tg , high Tg material and halogen free material )
  • Low-DK laminate for smart devices
  • Signal integrity enhancement
  • Edge plating capability

 


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Manufacturing Process

AOI Test

AOI Test

Outer Layer Horizontal Line

Outer Layer Horizontal Line

Flying Probe Test

Flying Probe Test

Laser Routing

Laser Routing

Drilling Machine

Drilling Machine

Drilling Process

Drilling Process

Auto Loading

Auto Loading

Fixture of E-test

Fixture of E-test

LDI

LDI

Drilling

Drilling

AOI

AOI

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Technical Parameter

No. Capabilities Standard Production Advanced Production
1 Stack up Blind/Buried/Anylayer board Lamination times MAX≤5times MAX≤6times
Copper thickness Inner layer 1/3OZ-2oz
MAX 2OZ
1/4OZ-2oz
MAX OZ
Outer layer 1/3OZ-3OZ 1/3OZ-2OZ
Min Dielectric ThK 35um(1027) 30um (1017)
Structure 1-N-1 / 2-N-2 / 3-N-3  1-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / ELIC(12L)
Layer count 4-24 4-34
2 Min. Line/Space Min L/W (inner) 2/2mil (50/50um) 1.6/1.6 mil ( 40/40um)
Min. L/W (Outer) 2.4/2.4mil (60/60um) 2/2mil (50/50um)
3 Line/Space Inner Layer Tenting 2/2mil (50/50um) 1.6/1.6 mil ( 40/40um)
mSAP 1.4/1.4mil (40/40um) 1.2/1.2mil (35/35um)
Outer layer Tenting 3/3mil (75/75um) 2.4/2.4 mil ( 60/60um)
mSAP 2.4/2.4mil (60/60um) 2/2mil (50/50um)
Pad size inner layer min size 225um 200um
outter layer min size 225um 200um
4 Drill min Mechanical Drill size 0.2mm 0.15mm
PTH plating A/R ≤8:1 ≤10:1
PTH Hole Tolerance ±0.075mm ±0.075mm
NPTH Hole Tolerance ±0.05mm ±0.05mm
Plated slot tolerance Long slot ±0.075mm ±0.075mm
Short Slot ±0.1mm ±0.1mm
5 Min BGA Min BGA/ BGA pitch 0.4 0.35
6 Laser Min. Laser hole size 75um 50um
Min. distance from laser hole to laser hole 0.025mm 0.025mm
Laser hole plating A/R  ≤0.8:1 ≤1:1
7 Soldermask Color Green,Yellow,Black,Blue,Red, White, Matt green Green,Yellow,Black,Blue,Red, White, Matt green
SM ThK Single print thickness 10-30um 10-30um
Min SM dam 3.0mil 2.5mil
8 Impedance Capability of Impedance Single line impedance<50Ω ±3.5Ω ±3.5Ω
Single line impedance≥50Ω ±10% ±7%
Differential line impedance ±10% ±7%
9 Tolerance capability Patten size tolerance pad size tolerance ±20% ±15%
line tolerance ±20% ±15%
  patten to outline  +/- 0.0075mm  +/- 0.0050mm
Registration tolerance laser A/R 100um 75um
PTH A/R 100um 75um

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