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软硬结合板及软板为将多个刚性电路板组件集成到单个电路板的需求中提供了可靠的解决方案。这些产品还可以减少电路板的整体重量和解决空间要求。

 

柔性印刷电路板是刚性电路和柔性电路优点的结合。该技术允许用户实现各种优势,如信号传输、稳定性和尺寸。我们是这类板材的领先生产商,拥有广泛的专业知识和产品经验。

 

我们的工程师能够为客户提供设计指导,并帮助他们找到满足其产品特定需求的最佳解决方案。通过我们在软硬结合板及软板设计领域的丰富经验,我们能够帮助他们提高整体产量并降低生产成本。与客户的密切合作使他们能够创建创新和可持续的解决方案,并帮助客户优化产品设计。


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What can we do?

为了应对对柔性印刷电路板日益增长的需求,我们还能够支持核心HDI技术与柔性印刷电路板相结合的批量生产。

Technical Characteristics

  • 先进 HDI & 软硬结合板
  • 产品结构可设计总层数2-24L;软板区域1-6L
  • 支持精细线路设计最小线宽/线隙为40/40um
  • 软板+高TG FR4的层压组合通过UL认证
  • 软板+高TG FR4无卤基材的组合通过UL认证
  • 软板层可设计对称和不对称叠层,可实现超薄厚度覆盖膜+软板产品组合,产品可设计动态弯曲
  • 表面处理方式可根据产品性能及客户需求选择
  • 软硬结合板可实现高频/高速,以及厚铜(内层2oz,外层3oz)需求设计

 


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Manufacturing Process

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Technical Parameter

No.   ITEM MP Capability NPI Capability
1 Panel size Double side ENIG/Immersion Tin 250/500*1200mm 250/500*1200mm
≥4 layers 沉金/沉锡
ENIG/Immersion Tin
250/500*710mm 250/500*1200mm
2 Stack up Blind/Buried board Pressing times MAX≤3times MAX≤3times
铜厚能力 Inner layer 1/3OZ-2OZ(软板基材最大铜厚)
MAX 2OZ
1/3OZ-2OZ(软板基材最大铜厚)
MAX 2OZ
Outer layer 1/3OZ-3OZmm 1/3OZ-3OZmm
Min Dielectric ThK 0.025mm(软板基材)
0.043mm(硬板基材)
0.0125mm(软板基材)
0.043mm(硬板基材)
Max Layer count 18层
18L
24层
24L
Final board ThK Tolerance ThK≤1.0mm ±0.1mm ±0.1mm
ThK>1.0mm ±10% ±10%
3 Line/Space Inner Layer 1/3OZ 2/2mil 1.5/1.5mil
1/2OZ 2.5/2.5mil 2/2mil
1OZ 3.0/3.0mil 3.0/3.0mil
2OZ 6/5.5mil 6/5.5mil
外层线宽/线距 1/3OZ 3/3mil 3/3mil
1/2OZ 3.5/3.5mil 3.5/3.5mil
1OZ 5/5mil 5/5mil
2OZ 6/8mil 6/8mil
3OZ 8/11mil 8/11mil
Pad Tolerance ≤12mil ±1.2mil ±1.2mil
>12mil ±10% ±10%
4 Drill Mechanical Drill size 0.15-6.35mm 0.1-6.35mm
PTH Hole Tolerance ±0.075mm ±0.075mm
NPTH Hole Tolerance ±0.05mm ±0.05mm
Plated slot tolderance Long slot ±0.075mm ±0.075mm
Short Slot ±0.1mm ±0.1mm
Aspect Ratio  孔径=0.15mm 7:1 7:1
孔径=0.2mm 10:1 10:1
孔径 ≥0.25mm 15:1 15:1
Back drill(Back drill/Depth-control drill) Hole size 0.4-6.35mm 0.4-6.35mm
 Back drill relative to through hole 整体大0.2mm 整体大0.2mm
Back drill depth tolerance ±0.1mm ±0.1mm
Stub length 0.05-0.25 0.05-0.25
5 Min BGA 1.0mm BGA 2 trace Yes Yes
0.8mm BGA 1 trace Yes Yes
0.65mm BGA Yes Yes
0.5mm BGA Yes Yes
0.4mm BGA Yes(Sample) Yes(Sample)
6 Laser Laser hole size 0.07-0.2mm 0.05-0.2mm
Laser hole size ≤1:1 ≤1:1
7 Soldermask Color Green,Yellow,Black,Blue,Red, White, Matt green Green,Yellow,Black,Blue,Red, White, Matt green
SM ThK Single print thickness 10-30um 10-30um
Double  print thickness 20-60um 20-60um
The line corner ≥5um ≥5um
Min SM dam normal color 3.0mil,other color min 4mil normal color 3.0mil,other color min 4mil
8 Resin plugging hole size 0.15-0.6mm 0.1-0.6mm
PCB ThK 0.3-3.0mm 0.3-3.0mm
Resin plugging aspect ratio 12:1 12:1
9 Impedance Capability of Impedance Single line impedance<50Ω ±5Ω ±3.5Ω
Single line impedance≥50Ω ±10% ±7%
Differential line impedance ±10% ±7%

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