With the continuous improvement and development of PCB technology, the application scenario of HDI PCB is no longer limited to consumer electronics, cell phones and personal computers, but has been expanded to industrial control, automotive, communication, data processing, medical, display, aerospace, etc. It is under this opportunity that JOVE Group has established a new HDI Division and a new automated, intelligent production plant.

 The new factory is built in accordance with the requirements of the automotive class, covering various fields such as industrial control, automotive, communication, data processing, display, etc. The technical level can fully meet and cover the various technical requirements of customers for HDI PCBs, such as fine line, high precision, high alignment, ultra-tight tolerance requirements, etc. The stack design ranges from 4-layer 1st order, up to 12-layer anylayer, and up to 32-layer HDI PCBs.

 Compared with traditional consumer HDI, HDI in other fields has more demanding requirements, higher reliability requirements, more kinds of materials (high frequency, high speed, low loss, PTFE, etc.) applications, and higher requirements for process design, process quality control, material characteristics, and reliability testing, JOVE HDI Division has rich management, from engineering design optimization, material knowledge and selection, process design and monitoring, and reliability assurance and monitoring, we can fully meet the requirements of the new generation of HDI PCB applications.

   JOVE's layout in this direction will aim to create products with higher reliability, higher technical level, and comprehensive application coverage.